Enabling Additive Manufacturing Part Inspection of Digital Twins via Collaborative Virtual Reality
Authors:
Vuthea Chheang,
Saurabh Narain,
Garrett Hooten,
Robert Cerda,
Brian Au,
Brian Weston,
Brian Giera,
Peer-Timo Bremer,
Haichao Miao
Abstract:
Digital twins (DTs) are an emerging capability in additive manufacturing (AM), set to revolutionize design optimization, inspection, in situ monitoring, and root cause analysis. AM DTs typically incorporate multimodal data streams, ranging from machine toolpaths and in-process imaging to X-ray CT scans and performance metrics. Despite the evolution of DT platforms, challenges remain in effectively…
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Digital twins (DTs) are an emerging capability in additive manufacturing (AM), set to revolutionize design optimization, inspection, in situ monitoring, and root cause analysis. AM DTs typically incorporate multimodal data streams, ranging from machine toolpaths and in-process imaging to X-ray CT scans and performance metrics. Despite the evolution of DT platforms, challenges remain in effectively inspecting them for actionable insights, either individually or in a multidisciplinary team setting. Quality assurance, manufacturing departments, pilot labs, and plant operations must collaborate closely to reliably produce parts at scale. This is particularly crucial in AM where complex structures require a collaborative and multidisciplinary approach. Additionally, the large-scale data originating from different modalities and their inherent 3D nature pose significant hurdles for traditional 2D desktop-based inspection methods. To address these challenges and increase the value proposition of DTs, we introduce a novel virtual reality (VR) framework to facilitate collaborative and real-time inspection of DTs in AM. This framework includes advanced features for intuitive alignment and visualization of multimodal data, visual occlusion management, streaming large-scale volumetric data, and collaborative tools, substantially improving the inspection of AM components and processes to fully exploit the potential of DTs in AM.
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Submitted 21 May, 2024;
originally announced May 2024.
MPI Implementation Profiling for Better Application Performance
Authors:
Riley Shipley,
Garrett Hooten,
David Boehme,
Derek Schafer,
Anthony Skjellum,
Olga Pearce
Abstract:
While application profiling has been a mainstay in the HPC community for years, profiling of MPI and other communication middleware has not received the same degree of exploration. This paper adds to the discussion of MPI profiling, contributing two general-purpose profiling methods as well as practical applications of these methods to an existing implementation. The ability to detect performance…
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While application profiling has been a mainstay in the HPC community for years, profiling of MPI and other communication middleware has not received the same degree of exploration. This paper adds to the discussion of MPI profiling, contributing two general-purpose profiling methods as well as practical applications of these methods to an existing implementation. The ability to detect performance defects in MPI codes using these methods increases the potential of further research and development in communication optimization.
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Submitted 19 February, 2024;
originally announced February 2024.
