The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE probe cards and packaged device load boards. By Anne Meixner. https://lnkd.in/gjw-siqG #HPC #highperformancecomputing #PDN #powerdeliverynetwork Michael Keene Teradyne Davide Appello Technoprobe Trang Nguyen NI (National Instruments) Ian Mazsa Cohu, Inc. Simondavide Tritto Advantest #ATE #semiconductortest
Semiconductor Engineering
Online Audio and Video Media
Silicon Valley, CA 83,949 followers
Deep insights for the tech industry
About us
Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations and standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors, as well as insights into the market dynamics that make it all possible. The goal of this site is to provide useful, independently developed content through targeted monthly newsletters, weekly updates, timely news alerts, videos, independent research, and a portal that serves as a forum for exchanging ideas and answering questions.
- Website
-
http://semiengineering.com
External link for Semiconductor Engineering
- Industry
- Online Audio and Video Media
- Company size
- 2-10 employees
- Headquarters
- Silicon Valley, CA
- Type
- Self-Owned
- Founded
- 2013
Locations
-
Primary
Silicon Valley, CA, US
Employees at Semiconductor Engineering
Updates
-
Special Report: Intel Vs. Samsung Vs. TSMC Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish. By Ed Sperling. https://lnkd.in/gYhzuy6s #semiconductor #semiconductormanufacturing #EMIB Intel Corporation Samsung Semiconductor TSMC Intel Foundry Lalitha Immaneni Rene Haas Arm #chiplets TAEJOONG SONG #backsidepowerdelivery #CFETs #HBM #UCIe
-
Semiconductor Engineering's latest Test, Measurement and Analytics Newsletter: https://lnkd.in/gm-A_Wpv #semiconductor #semiconductortest #semiconductormanufacturing #advancedpackaging #digitaltwins #automotivetest PDF Solutions Nordson TEST & INSPECTION proteanTecsAdvantest Synopsys Inc Onto Innovation Bruker Nano Surfaces & Metrology DR YIELD Teradyne NI (National Instruments)
-
Solving battery management, utilization, charging and vehicle-to-grid issues is essential to boosting EV adoption. By Ann Mutschler. https://lnkd.in/gVymtwVW #EVs #ElectricVehicles #batteries #batterycharging Puneet Sinha Kumar Srinivasan Cadence Design Systems Siemens Digital Industries Software Jayson Bethurem Flex Logix Technologies, Inc. Wayne Lyons AMD #batterymanagement #GaN #SiC Intel Corporation Gary Martz
-
Latest news: Softbank’s acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships and more.. https://lnkd.in/eDHh6RiG #semiconductor #semiconductormanufacturing #EDA #advancedpackaging Onto Innovation U.S. Department of Commerce SEMI Applied Materials SoftBank Group Corp. CMC Microsystems ASE Global ISE Labs PhotonDelta Samsung Electronics MELEXIS SOITEC United Microelectronics Corporation (UMC) Natcast.org AMD Accenture UC San Diego Ansys Infineon Technologies Advantest Siemens Digital Industries Software CEA-Leti @
Chip Industry Week In Review
https://semiengineering.com
-
X-Ray Inspection Becoming Essential In Advanced Packaging https://lnkd.in/dZSa6kSx Improvements in speed and precision have transformed a research tool for studying defects in chips into an industry workhorse. By Gregory Haley. #semiconductor #advancedpackaging #inspection #xrayinspection #semiconductormanufacturing #HBM Daniel Chen Bruker Nano Surfaces & Metrology Brad Perkins Nordson Corporation Fred Duewer Adi Shulner PDF Solutions Michael Yu Keith Schaub Advantest Mark Kahwati Teradyne #chiplets
-
91 startups raise $2.6 billion, with big rounds for AI chips. By Jesse Allen. AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing specialized IP. Ways to connect chiplets, chips, and server racks was another area of activity, with Germany pumping more than $200 million into a graphene-based co-integrated optics system for massively parallel connectivity. Other optical interconnect approaches drew attention, as well, along with a way to make ultra-high density interconnects using liquid metal ink. https://lnkd.in/g2eY6g53 #semiconductor #AIhardware #startups #startupfunding #venturecapital TXOne Networks Black Semiconductor PsiQuantum Rivos Inc. Bright Machines Hailo Etched Blaize DEEPX Frore Systems SiMa.ai Axelera AI Prewave MetisX actnano PQShield Expedera Inc. Rain AI Innatera RaiderChip Liquid Instruments AlixLabs Prewave Thintronics® actnano Synthara AG ZeroPoint Technologies RAAAM™ Memory Technologies MetisX Flow Computing Morphing Machines Niobium Microsystems AMAG nanometro Atom Computing
Startup Funding: Q2 2024
https://semiengineering.com
-
Digital Twins Find Their Footing In IC Manufacturing:https://lnkd.in/gEU48sGB Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. By Laura Peters. #semiconductor #digitaltwins #semiconductormanufacturing Anjaneya Thakar Joseph Ervin Lam Research Synopsys Inc James Moyne Sameer Kher Ansys Indranil Sircar Microsoft PDF Solutions Ranjan Chatterjee SEMI University of Michigan
-
Thermal Challenges Multiply In Automotive, Embedded Devices The small sizes and tight tolerances of embedded devices create big problems for reliability. https://lnkd.in/gyzPWcFH #embedded #thermalmanagement #semiconductor #automotive Ketan Dewan Infineon Technologies Marc Swinnen Ansys John Ferguson Siemens Digital Industries Software Melika Roshandell Cadence Design Systems geoffrey tate Flex Logix Technologies, Inc. Nordson TEST & INSPECTION
-
Semiconductor Engineering reposted this
Chip industry news recap: https://lnkd.in/gs2NHGxP Sk Hynix’s bets big on HBM; GF’s purchase; Altair acquires EDA company; high-performing, low-power LLM without matrix multiplication; US Tech Hubs funding; Renesas-Altium deal passes key test; workforce drive; imec’s CMOS 2.0. 3D interconnect and backside technologies and more... #semiconductor #EDA #HBM #LLMs #acquisitions SK hynix GlobalFoundries Rogue Valley Microdevices, Inc. SILICON BOX SEMI Cadence Design Systems Google Renesas Electronics Altair Natcast.org Purdue University College of Engineering Purdue University Eindhoven University of Technology KU Leuven Mixel, Inc. Flex Logix Technologies, Inc. stiftung neue verantwortung University of California, Santa Cruz Rui-Jie Zhu, Yu Zhang, Ethan Sifferman Julien Ryckaert Christina Rupp ASML Metrics Design Automation Cadence Design Systems