Douglas Woolverton

Electrostatic discharges present real possibilities for causing damage and failures to sensitive electronic components for manufacturers. Learn how IONA Tech adopted Creo as their preferred CAD system to create the innovative StatIQ Band that monitors and reduces the risk of ESD damage. Read their story:

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Cross-section for dissociative electron attachment can be estimated. This is necessary for EUV resists. https://lnkd.in/ghu9jubZ

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The small sizes and tight tolerances of embedded devices create big problems for reliability.

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Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching

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Latest article from Imec on the chiplet interconnect technology.

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In "The Path Toward Future Automotive EE Architectures" at Semiconductor Engineering, I look at the path toward future EE Architectures. Evolution or revolution? There are many different approaches, but the most fascinating aspect to me is that some OEMs, like Dean Drako‘s Drako Motors, simply jumped to the finish line with a fully integrated, central computing solution, as described by Shiv Sikand at an ESDA event last October. It's fascinating to see the William Gibson quote, "The future is already here, it’s just not evenly distributed yet," play out in reality. Exciting times! #Arteris #NetworkOnChip #Automotive

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Learn how Nuvera Fuel Cells, LLC uses Simulink from MathWorks and Speedgoat hardware to design, prototype and deploy hydrogen fuel cells and reduce millions of tons of CO2 emissions at seaports each year. #fuelcell #fuelcells #fcevs #hydrogeneconomy #hydrogenfuelcell #hydrogenpower #matlab #simulink https://spr.ly/6048gwKKA

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The attacched report talks about foundries ranking. In recent months I have been asked which foundries I would choose for a new chip design. While TSMC remains a popular choice, exploring options like Samsung Semiconductor, GlobalFoundries, and Intel Corporation (Missing from the attached list) can offer unique benefits ( specialized processes in III-V, cost models, and scheduling). Today, designing for multiple foundries has been simplified by leveraging IP from suppliers like Cadence Design Systems, Synopsys Inc, and other. #ChipDesign #Foundries #TechnologyIndustry

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I have the privilege of discussing the challenges of measuring micro-lens arrays at the Advanced Manufacturing Alliance. I’m looking forward to an engaging conference and interesting conversation around metrology of these important optical components. Optica Opto-Alignment Technology, Inc. #metrology #microlens

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Learn more about flexible sensors and circuits at this Sensors Converge pre-conference workshop. #sensors #mems #ICs #circuits #flexible #wearables Roger Grace Ramesh Yadav Robert A. Marcelo Zuffo

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Read this blog to get a chip-centric perspective on how to perform power integrity analysis in 3D-ICs at the early planning stage. https://ow.ly/NQ6930sC4Iz

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Jim Keller, a genius in chip design, recently participated in an interview with the mass media. Keller is a legendary figure in the semiconductor industry, having designed Tesla’s original self-driving chip, led the architecture of AMD’s Athlon and Ryzen processors, and contributed to the design of mobile application processors (such as the A4 and A5) for iPhones. Currently, he serves as the CEO of Tenstorren, an AI chip startup company. During the interview with ChosunBiz, Keller shared his insights on the future of the AI industry and technology. Despite acknowledging potential negative influences, Keller expressed an optimistic view. He believes that the advantages of AI technology will ultimately outweigh any drawbacks. For instance, he highlighted how smartphones have replaced computers and CD-ROMs have disappeared, illustrating the trend of AI gradually replacing traditional software. Keller also noted that while humans used to write thousands of lines of code for voice recognition development, AI can now process voice recognition much faster through neural networks. Regarding education for the next generation in the context of rapid AI development, Keller challenged the conventional approach. He considers teaching programming and CAD (computer-aided design) in schools to be misguided. Instead, he advocates for reinforcing the teaching of fundamental subjects such as reading, writing, mathematics, chemistry, physics, history, music, art, and philosophy. Interestingly, Keller himself did not study computer science or architecture in college; rather, he pursued physics, electrical engineering, electromagnetism theory, calculus, astronomy, biology, and philosophy. According to him, this diverse foundation enables students to learn how to think critically and unleash their creative potential. Ironically, Jim Keller mentioned that he doesn’t typically use AI chatbots like ChatGPT, even though he works as an engineer in AI chip design. Interestingly, this parallels his past behavior: despite being a chip designer for video games, he never played video games himself; instead, he immersed himself in reading books. While reading his interview, we gain insights into how he thinks about the development of AI technology and its impact on the world. However, the most remarkable aspect of the interview is that Keller, despite his role in designing chips for video games, never engaged in playing video games. https://lnkd.in/e9eKcy4f

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The DC charging system market will reach a value of $23.7 billion by 2029 💡 DC #EVcharging represents a relatively new business opportunity for power #electronics players. This market will be sustainable since an increasing number of #charging points are deployed year after year, and soon the issue of replacement will emerge. AC chargers will remain as long as onboard Chargers (OBCs) exist by default in cars; OBCs will remain as long as DC infrastructure is not strongly consolidated ‘everywhere’ (likely in 10-15 years). The total EV DC charging system market will reach $23 billion by 2029. In 2023, the largest market segment in $M was chargers between 50 and 150 kW. Nevertheless, the demand for high-power chargers is rapidly growing, with a strong demand for power over 150kW. In 2029, the largest market value, $9.2 billion, will be associated with the very high-power (150 kW ≤ x ≤ 350 kW) charger. The adoption of a 1,000 V charger will simplify the choice for EV owners to ‘plug and go’ regardless of battery pack voltage (400V or 800V). OEMs with EVs based on 800 V battery approach would not struggle anymore how to adapt their batteries to 500V chargers. This will lead to volume, weight, and cost reduction on vehicle level. Thanks again to Yole Group for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eTqfA_iT #powerelectronics #semiconductor #semiconductors #car #cars #ev #ic #chip #chips #sic #evhehicles #automotiveindustry #electrification #DC

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The semiconductor industry is expected to surge to a massive $1 TRILLION in average annual sales by 2030! 📈 As this arena explodes, Rayton offers you the chance to secure your own stake in next-gen technologies defining the future. Through pioneering approaches producing high-value gallium nitride engineered with atomic precision, we're overcoming big barriers facing electronic innovation. ⚡️ Now major players in electric vehicle and renewable sectors express strong interest in what our breakthrough manufacturing techniques enable. We stand ready to demonstrate revolutionary domestic production capabilities. Join the 7000+ investors backing our vision to reshape the global semiconductor landscape. An investment in Rayton represents a piece of the exponential innovation trajectory ahead. 📡 Check out our Wefunder page to be part of the history in the making: https://lnkd.in/g2PzSu_D Help blaze the trail towards democratized access to the $1T semiconductor revolution in the making! 💻 #MadeInAmerica #OnshoreManufacturing #InvestInInnovation #Rayton #Wefunder #GaN #ElectricMobility #RenewableEnergy #MaterialsScience #SemiconductorRevolution #TechnologyOfTomorrow #BuildingTheFuture

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TNL-EpiGrow simulator: Example MBE epitaxy of group IV, IV-IV, III-V, II-VI etc. HgCdTe (MCT) Epitaxial MBE Growth Solution, published in Journal of Electronic Materials . TNL-EpiGrow simulator will surely help to diagnose the formation of various defects, strain etc. The solution to obtain the crystalline MCT film USER can do optimization of MBE process input parameters through simulation. Hit & trail with different substrate options to reduce the cost associated with MCT epitaxy. For more details: https://rdcu.be/dFtco #MBE, #MOVPE, #MOCVD, #MCT, #Narrowbandgap, #Defects, #thinfilm, #Roughness, #LatticeParameter, #Epitaxy, #Growth, #ThinFilm, #HgCdTe, #Infrared, #Detector, #CdTe, #Si, #GaSb, #GaAs, #QuantumWell, #Nanosheet, #Optoelectronics, #Qualcomm, #Huawei, #IMEC, #IBM, #Intel, #Samsung, #WinSemiconductor, #TSMC, #GF, #TEL, #Wafer, #EpiWafer, #Vacancies, #dislocation, #TDD, #Crystalline, #Reactor, #GrowthRate, #Silvaco, #Synopsis, #EPIR, #Teledyne, #NASA, #DARPA, #CEALETI, #IME, #IMRI, #IHPC, #EPIR, #DRDO, #ISRO, #Defence, #NightVision, #Thermal, #Imaging, #IR, #MWIR, #LWIR, #SWIR, #T2SL, #HOT, #SMIC, #IIT, #IISC, #Teledyne, #E2V, #DRS, #LEONARDO, #ShivananthanLab, #IllinoisUniversity, #Meity, #PMO

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━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Injection molding with thermal-conductive and EMC shielding ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ This injection-molded product incorporates our proprietary material technology, providing both high heat release and electromagnetic shielding capabilities. Product Description: As a solution to the societal challenge of improving travel range (electricity consumption), we have achieved weight reduction by transitioning from metal to resin. Features: 1. Lightweight: Our product uses a resin that is about 45% lighter than aluminum, reducing the weight of a single vehicle by approximately 7kg. 2. EMC shielding plus heat release: In addition to EMC (Electromagnetic Compatibility) shielding capabilities, our product also offers heat dissipation properties. 3. Process Efficiency: The reduction in the number of parts, simplification of the production process, and decrease in the frequency of equipment maintenance enable improved work efficiency. 4. OBC housing Concept: Through innovative design and the use of heat-dissipating materials, we have achieved heat dissipation performance equivalent to or greater than that of aluminum. With these features, our Injection molding with thermal-conductive and EMC shielding represents a product that balances both lightweight and high-performance attributes. Download the document for more details. 🚘 🙆‍♀️ https://lnkd.in/grKzv-zX #heatrelease #heatdissipation #thermalcontrol #automotivesafety #EMCshielding

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Our Featured Video this week comes from Cadence Design Systems Watch and learn from Ben Gu, VP of the Multiphysics Analysis Group at Cadence, as he explains how to address the thermal and power integrity management challenges of 3D IC integration for chiplets, using a holistic approach rather than analyzing each chiplet separately. You'll learn about evaluating the implications of multiple 3D-IC topologies—such as CoWoS, InFO, SoIC, F2F, EMIB, etc. and the importance of fast prototyping and analysis to understand cost and performance tradeoffs for the different 3D-IC architectures. https://lnkd.in/gg-jyEid

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🚀 Swiss Electrification & Battery Day, May 15, Bern. Learn from 5 Swiss researchers and industry leaders on the latest in battery technology. Gain insights in battery simulation and integration, safety, and sustainability. Connect with fellow engineers. 🔋💡 #Electrification #BatteryInnovation

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