KLA’s Post

Sam Altman’s ambitious quest to raise $7 trillion to overhaul the semiconductor industry epitomizes the pioneering spirit driving technological advancement. While the road ahead may be fraught with challenges, Altman’s vision offers a glimpse into a future where AI-driven innovations flourish unhindered by chip shortages. As OpenAI continues to push the boundaries of AI research, Altman’s initiative could catalyze a transformative shift in the global tech landscape.

CSconnected welcomes today’s announcement by Saqib Bhatti MP MBE that a UK National #Semiconductor Institute will be established to coordinate semiconductor related activities across the UK. The announcement was made on the first anniversary of the launch of a UK semiconductor strategy and follows recommendations in a report commissioned by the Department for Science, Innovation and Technology following industry engagement over the last year. CSconnected looks forward to a close working relationship with the National Semiconductor Institute which supports the cluster’s vision to make the UK more competitive and sovereign across the tech sector in applications ranging from handsets to data centres, mobility and net-zero applications, healthcare, robotics and AI. https://lnkd.in/eBdhUjyD

minds.ai is at #semiconeuropa2023 this week! If you are there, reach out to our CTO, Jasper van Heugten while he is there! #semiconductormanufacturing #semiconeuropa #smartmanufacturing #semiconductor

US, Japan to Advocate Enhanced Collaboration in AI and Semiconductors, Reports Asahi TechShots I Adding Intelligence to Enterprise Information Technology Buying #advocate #collaboration #semiconductors https://lnkd.in/gC69UBhD

The semiconductor industry is at the cusp of a dynamic transformation, driven by electrification, AI, and disruptive technologies. The surge in the semiconductor automated test equipment (ATE) segment highlights the need for advanced solutions. Leveraging strategic partnerships with key players like Intel, Samsung, TSMC, and leading automotive companies is essential. These collaborations foster innovation and help navigate complexities, positioning companies to capitalize on growth opportunities. How is your team preparing for the future? Read on: https://frost.ly/a80 📅 Schedule a Growth Pipeline Dialogue with our experts https://frost.ly/85w #Semiconductor #InnovationLeadership #AutomatedTestEquipment #TechCollaborations #GrowthOpportunities

We are living during a time of accelerated digital transformation, where generative #AI and advanced semiconductors touch every facet of our lives. How is Samsung's #SystemLSI business working to evolve our core technologies for this extraordinary era? Check out our latest article explaining how Samsung System LSI is bringing innovations to meet the technological requirements of the Fourth Industrial Revolution.    http://smsng.co/TechDay_A1

#SEMICON Korea 2024 will kick off on Wednesday, January 31st in COEX, Seoul, Korea. This Conference and exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry. Fore more details visit: www.semiconkorea.org. The Market Trends Forum will be on Wednesday, 13:00 - 16:14; E. Jan Vardaman from TechSearch International is scheduled to present packaging market trends from 15:15 - 15:45. Advanced Semiconductor Packaging Market Trends High-performance computing (HPC), especially the explosion of artificial intelligence (AI), is driving the advanced semiconductor packaging market. In this new era silicon and packages are co-designed and the use of heterogeneous integration and chiplets is a key enabler. Packaging options including silicon and high-density fan out (HDFO) options are increasingly used. High-density substrates are required to support the next generation of HPC including chiplets. Substrate body size is increasing with the use of an increased number of high bandwidth memory (HBM) stacks. New methods to form high-density substates are being developed. This presentation discusses the package options including silicon interposers, redistribution layers, and new versions of organic substrates.

Nepes gave a lecture on advanced semiconductor packaging technology at 'Nano Korea 2024 Industrialization Session' held at KINTEX 1st exhibition hall in Goyang City on the 4th. Kim Jong-heon, vice president of Nepes CTO, said, "The advanced packaging technology in AI era; Chiplet and Integration ', introduced chiplet and heterogeneous packaging technology, a cutting-edge semiconductor packaging trend. Vice President Kim Jong-heon said, "The development of Gen AI is accelerating changes in many fields such as life and industry," and explained, "In the packaging field as well as the entire semiconductor process, AI semiconductor-oriented bumping, 2.5D, and chiplet technologies continue to develop, and Nepes also has and develops related technologies and is pushing for commercialization."He added, "In addition to packaging technology, heat dissipation performance, which is closely related to power consumption, is also becoming important." He emphasized the importance of developing innovative materials along with package structure design. Read More https://lnkd.in/g6P4wWcJ 해시태그 #Chiplet #2.5D #HBM 해시태그 #AI 해시태그 #RDL 해시태그 #nepes 해시태그 #OSAT 해시태그 #AdvancedPackaging 해시태그 #heterogeneous 해시태그 #packaging 해시태그

The medical device industry comes with its own unique challenges that require a careful balance of collaboration and innovation. In this episode of MedTech Beyond, we sit down with industry leaders to learn more about the innovation that happens behind the scenes. Watch the full series 👉 https://dky.bz/3sV7XOq NXP Semiconductors RECOM Power Supplyframe #Innovation #AI #Engineering

China's rapid strides in chiplet technology are unmistakable. Recent revelations highlight a technology transfer from zGlue's patents to China's Chipuller, aligning with China's drive for semiconductor self-reliance. As global chip competition heats up and access to advanced equipment remains limited, chiplet technology emerges as a pivotal asset, fueling China's ambitions across AI, self-driving cars, and more. https://lnkd.in/gF93EnW4 #VXDynamic #Technology #ChipletTechnology